Thin-Film Metallizations of Diamond Substrates & Silicon Carbide Substrates.

Because of their excellent thermal conductivity, Diamond & Silicon Carbide substrates are being used more frequently for superior thermal management of Semiconductor and Electro-Optical devices under performance.
Using our proprietary processes we can now grow durable and rugged thin-films of various metals on these substrates, rendering them suitable for mounting electronic components.
Some of the typical metallization layers are Nickel, Copper, Silver, Gold, Palladium, Platinum, Titanium, etc.