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SOLUTIONS FOR PHOTONICS PACKAGING
- BUMPS Technology FOR FLIP CHIP Packaging
- Eutectic Solder layers coated Optical fibers
Production proven Metal BUMPS technology with Metals & Alloy compositions using:
- INDIUM
-COPPER
-GOLD
-LEAD:TIN(Pb:Sn)
-GOLD:TIN(Au:Sn)
-GOLD:GERMANUIM(Au:Ge)
-Eutectic Solder BUMPS deposit endusing Computer controlled co-deposition
technology to achieve precise alloy compositions.
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